In the world of CMOS image sensors, Sony has long been seen as a master in its own right, but Samsung is now making serious strides to close the gap. Recently, the company unveiled a groundbreaking three-layer stacked image sensor capable of capturing up to 1000 photos per second—nearly matching the performance of professional cameras. In February this year, Sony introduced the world's first three-layer stacked sensor, the IMX400, which was later used in its Xperia XZ Premium smartphone, offering an impressive 960fps video recording capability.
Samsung’s new design follows a similar approach, integrating the sensor chip, logic circuit (responsible for processing), and DRAM buffer (for temporary data storage) using TSV (through-silicon via) technology. This allows the sensor to shoot at an ultra-fast 1000fps, surpassing Sony’s IMX400 in speed. Most current CMOS sensors only have two layers, but the inclusion of a dedicated DRAM buffer is key to achieving such high-speed performance. Samsung plans to mass-produce this new sensor in November, with expectations that it will be featured in the upcoming Galaxy S9, launching early next year.
Interestingly, Samsung often uses a mix of its own sensors and Sony’s in its flagship devices. However, compared to Sony, Samsung holds a stronger position in the supply chain. It can manufacture both the logic circuits and DRAM internally, whereas Sony relies on third-party suppliers like Micron for its DRAM (1Gb). This gives Samsung an edge in terms of cost efficiency and memory capacity.
The IMX400 structure diagram illustrates how Sony has optimized its three-layer design to deliver superior performance, and with Samsung now entering the same space, the competition between these two giants is heating up. As both companies continue to push the boundaries of mobile imaging, consumers can expect even more advanced camera capabilities in future smartphones.
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