In the world of CMOS image sensors, Sony has long been a dominant force, often seen as a master in its own right. However, Samsung is now making significant strides to close the gap. Recently, the company unveiled a new three-layer stacked image sensor capable of capturing up to 1,000 photos per second—nearly matching the performance of professional cameras. In February, Sony introduced the world's first three-layer stacked sensor, the IMX400, which was later featured in the Xperia XZ Premium, offering an impressive 960fps video recording capability.
Samsung’s new design follows a similar approach, integrating the sensor chip, logic circuit (for data processing), and DRAM buffer (for temporary data storage) using TSV (through-silicon via) technology. This innovation allows it to shoot at an ultra-fast 1,000fps, surpassing Sony’s IMX400 in terms of speed. Most current CMOS sensors only have two layers, but the inclusion of an integrated DRAM buffer is key to achieving such high-speed performance. Samsung plans to mass-produce this new sensor in November, with the Galaxy S9 expected to launch early next year.
Interestingly, Samsung’s flagship devices often use a mix of its own sensors and Sony’s. While Sony remains a leader in image sensor technology, Samsung benefits from a more vertically integrated supply chain. It can produce both the logic circuits and DRAM itself, whereas Sony relies on Micron for its 1Gb DRAM. This gives Samsung a competitive edge in terms of cost efficiency and memory capacity.
The development marks a turning point in the race between the two tech giants, as Samsung continues to challenge Sony’s long-standing dominance in the image sensor market. With faster speeds, better integration, and stronger manufacturing capabilities, Samsung is clearly positioning itself as a serious contender in the future of smartphone photography.
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