Silan Micro agreed to set up a multi-chip high-voltage power module manufacturing line within the subsidiary's Shilan integration. It plans to invest RMB135 million in the next 2- to three years from 2010, including an investment of RMB 25 million in 2010.
Silan Micro announced on July 29 that the ninth meeting of the fourth board of directors of the company reviewed and approved the “Proposal on the Establishment of Power Module Production Line Project by Holding Subsidiariesâ€.
Multi-chip high-voltage power module components are getting more and more attention from the market due to their high power density and reliability, high integration, convenient installation and use, and the application fields are becoming more and more extensive. At present, Silan Microelectronics, which is integrated with chip design and manufacturing, has been in the chip production line of Hangzhou Silan IC Co., Ltd., a holding subsidiary of the company through the interaction of multiple technology platforms such as chip design, device structure development and process development. The development and production of high-voltage power device chips such as high-voltage integrated circuits, IGBTs, and fast recovery diodes have been completed. It has the basis of completely relying on self-developed circuits and device chips to complete the manufacture and packaging of high-voltage power modules.
The company intends to agree to set up a multi-chip high-voltage power module manufacturing line within the Silan integration. It plans to invest 135 million yuan in 2010-2010 in the next 2-3 years, including an investment of 25 million yuan in 2010.
Silan's current registered capital is 400,000 yuan, and the company holds 97.5% of its equity.
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