UshioLighting has developed a "highly integrated LED module" that integrates up to 327 LED chips on a 14mm square substrate. The three primary colors of integrated light - red (R), green (G), blue ( B) LED chips of various colors to obtain white light. Therefore, the average color rendering index (Ra) at a color temperature of 2700 K is increased to 95. Further, since it is different from the ordinary white LED, it is not necessary to cover the LED chip with a resin cover and a fluorescent material, and the temperature rise of the LED chip can be suppressed. It also prevents aging caused by heat of resin and fluorescent materials. It can be used in safety and precision exposure fields, inspection light sources and sensors.
The product developed this time integrates about 1.76 LED chips with an error of about ±30 μm per 1 mm 2 of the substrate. In addition to the use of a highly thermally conductive material for the substrate, the bonding of the substrate to the illumination assembly also replaces the silver paste with a "high melting point metal bond" process. By these means, heat dissipation is improved, and high luminous flux maintenance ratio and long life of the LED are achieved. By adjusting the LED chip combination, it can also support the range of illumination from infrared light, visible light area to ultraviolet light.
In the future, the company will use the technology developed to promote the "custom LED" business and manufacture modules that meet individual needs. Various options will be provided in terms of wavelength, output power, light distribution (mirrors, filters, lamps, etc.) and lamp sockets. Customers can freely combine and sneak when purchasing orders. The order is accepted in April 2009. The company named the business "MADEforYOU" and strives to achieve sales of 2 billion to 3 billion yen in 2011.
The company will be exhibiting this new product at the LightingFair 2009 (The 9th International Lighting Exhibition) held at the Tokyo International Convention and Exhibition Center from March 3rd to 6th, 2009.
The product developed this time integrates about 1.76 LED chips with an error of about ±30 μm per 1 mm 2 of the substrate. In addition to the use of a highly thermally conductive material for the substrate, the bonding of the substrate to the illumination assembly also replaces the silver paste with a "high melting point metal bond" process. By these means, heat dissipation is improved, and high luminous flux maintenance ratio and long life of the LED are achieved. By adjusting the LED chip combination, it can also support the range of illumination from infrared light, visible light area to ultraviolet light.
In the future, the company will use the technology developed to promote the "custom LED" business and manufacture modules that meet individual needs. Various options will be provided in terms of wavelength, output power, light distribution (mirrors, filters, lamps, etc.) and lamp sockets. Customers can freely combine and sneak when purchasing orders. The order is accepted in April 2009. The company named the business "MADEforYOU" and strives to achieve sales of 2 billion to 3 billion yen in 2011.
The company will be exhibiting this new product at the LightingFair 2009 (The 9th International Lighting Exhibition) held at the Tokyo International Convention and Exhibition Center from March 3rd to 6th, 2009.
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