Vishay Intertechnology, Inc. (NYSE: VSH) has recently launched a new power MOSFET, microBUCK DrMOS power ICs, and an updated version of its free online thermal simulation tool, ThermaSim 3.0. This advanced version offers enhanced features to improve the accuracy of thermal analysis, including die-temperature scaling for power dissipation, more realistic simulation conditions, and greater design flexibility. These improvements help reduce user complexity and provide more reliable results.
Unlike other thermal simulation tools that only simulate at the package level, ThermaSim uses finite element analysis (FEA) techniques to deliver higher accuracy. This makes it particularly useful in high-current and high-temperature applications such as automotive systems, fixed-line communications, desktop and notebook computers, and industrial equipment. The latest release is also ideal for designs with tight headroom or those subjected to transient events like UIS (unclamped inductive switching) and automotive load dumps.
ThermaSim 3.0 allows engineers to perform detailed thermal simulations of Vishay Siliconix’s power MOSFETs, ICs, and DrMOS products before building physical prototypes, helping to speed up the development process. The updated tool includes several new and improved features, such as:
**Transient Thermal Simulation (for MOSFET only):**
It supports time-scaling of power dissipation data, with up to 1,000 levels, improving design reliability. This feature is especially useful for high-power pulses (kW levels) and short durations (≥1 ns). The tool can also act as a thermal sink by using 10%, 15%, or 25% of the original MOSFET die area, enabling better analysis of low gate drive and drain-source voltage spikes.
**Enhanced User Experience:**
To save time and avoid data entry errors, users can now upload Excel-formatted power curve data. They can repeat uploads as needed and easily copy simulation results between different design scenarios. Additionally, the tool provides a graphical interface for placing components on the PCB, making the process more intuitive.
**Real-World Simulation Conditions:**
Users can define various real-world conditions, such as copper diffusion on both top and bottom layers of the PCB, solder thickness, solder joint quality, air gaps, glue or spacer thickness, and whether wire terminations are on or off the board.
**Efficient Simulations:**
With asynchronous reloading and a web-based interface (Ajax), along with load balancing and high mesh resolution, ThermaSim 3.0 delivers faster results, making it a powerful and efficient tool for thermal analysis in complex designs.
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