On May 7th, “2013 Zhongshan Lighting Quality Upgrade Strategy Conference†was successfully held in Xiaolan, Zhongshan. The conference attracted more than 400 business leaders.
The conference was jointly sponsored by Gaogong LED, Zhongshan Semiconductor Lighting Industry Association and Zhongshan Semiconductor Lighting Industry Technology Alliance. Zhongshan Science and Technology Bureau, Zhongshan Xiaolan Town People's Government as support unit, Philips Lumileds, Mulinsen Lighting, Mingwei Electronics, Confucian Electronics, Star Alliance Lighting, LED Lighting Expo Center, etc. are sponsors. It covers various key elements of enterprises, governments, business associations, high-end media, and exhibition platforms of regional industrial clusters.
Hong Ji Lighting General Manager Du Jifang, Pinshang Lighting Chairman Hong Ziang, Guangyang Lighting General Manager Chen Shaozhong, Xiaobailong Lighting Chairman Wang Yunlong, Ou Man Technology Lighting General Manager Li Xiaoping, Minguang Lighting General Manager Guo Huaguo, Shanghai Luyuan Lighting Standing Vice President Luo Quanxing, Ward Lighting General Manager Cai Xianghu, Yuzhiyuan Solar Technology Chairman Lei Zongping, Zhongshan Starlight Alliance Investment Co., Ltd. Zeng Shuneng, Guangbohui Managing Director Guo Xiu, Kyushu City General Manager Zhang Liqiang, Zhongshan Semiconductor Lighting Industry The delegation of the Association, Tu Qiaoling, and the Secretary of the Zhongshan Lighting Association, Mr. Decheng, and other 400 guests attended the meeting.
Wu Gan, executive deputy director of Hongli Optoelectronics Engineering Technology Center, believes that COB integrated light source has become the mainstream direction of high-power packaging. COB integrated light source is similar to LED point light source and becomes line light source or surface light source. Single LED is made into a fluorescent tube light strip. Or the integrated surface, after the light comes out, through the secondary optical treatment of the matte mask to make the light more uniform. The COB light source can improve the glare problem. As an application end, the assembly is more convenient, but at the same time, the light efficiency and luminous flux of the device are also lost.
Still need to distinguish from the market application, incandescent lamps above 100 watts will soon be banned. With the increasing demand for high lumens light source applications, there is no way to cross the SMD package. This is because one is the lighting fixture. The area is limited, the lumens that can be achieved with low power is limited, and the COB can meet the requirements of high power and higher lumens. The cost of the two COB packages is much lower than that of the SMD package. Because it not only has an advantage in heat dissipation, but also has a good performance in terms of price.
However, COB light sources still have many problems to be solved: First, the integrated package will reduce the light efficiency and light transmittance, and the wafer light efficiency and luminous flux can hardly reach a certain height. Second, whether the substrate technology can better solve the heat dissipation and heat conduction problems. Third, the packaging process, that is, the combination of the wafer and the substrate has a better thermal conduction process. Fourth, whether the epitaxial wafer is resistant to large currents, temperature, and quality is well done.
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