Then the appearance of the above article, let us open the secret box to see how the internal in the end.
Huawei's statement is based on the cell phone process to create a box, then look at what is in the end.
First, the bottom shell, plastic material, four corners with screws and the upper shell fixed, very strong. The three T-shaped projections press the motherboard to ensure that the motherboard is firmly attached.
Second, the upper shell, but also the entire plastic material, the interior is divided into many parts, to strengthen the stability of the upper shell to ensure that the whole machine is not deformed.
Third, the motherboard as a whole, including the positive and negative sides of the motherboard, each main IC has a shield, work is very reliable, reducing the internal electromagnetic interference. PCB overall work is also in place, many general manufacturers do not pay attention to details are in place, such as power inductors on the edge of copper hollowing, can reduce interference, many manufacturers have not seen on the box. After all, it is a big factory. The presumptiveness of light design and manufacture wins over other manufacturers. The black part below is the Bluetooth + WIFI antenna, which is a bit of a problem.
4. The global map of the mother board with the shield removed, and the photo on the opposite side, including a shield cross clip, are shortened. In order to see the WIFI chip, the original state is a cross bracket. Hereby explain.
Fifth, the internal IC part starts with the CPU. The entire surface is not marked with any K3V2, only one Elpida logo. In fact, this IC is stacked. Currently, there is no data to show whether the IC is a POP or an MCP. The POP is a package-level stack in which the CPU and the RAM are manufactured separately. When the IC is packaged, the ICs are packaged together. MCPs are wafer level stacks that are manufactured together at the time of manufacture. The K3V2 is an A9 quad-core with 1.2GHz and 1.5GHz versions. The 1.2GHz version is used on the box. A9 quad-core, GPU part is Vivante's GC4000, 16-core GPU. Do not be terrified by 16 nuclear, in fact, performance and Mail 400 MP4 quad-core GPU performance is similar, that is, the RK3066 GPU, and because of too much bias, the actual compatibility is not yet a good Mail 400 MP4.
The RAM part is Elpida's 1GB DDR2 800 Mobile RAM, model B8164B3PF-1D-F, a special version for mobile devices, which costs more than the PC pellets used on the general box. There is a problem, Elpida has been closed down, was acquired by Micron, then, this IC production time is Elpida still exists. It seems that recently, in order to clean up the K3V2 inventory, Huawei students spent a great deal of effort. Not only did they launch a series of K3V2 mobile phones, but they also continued to launch the main control box. They actively prepared for the launch of the next generation of new masters. Shanda.
Six, PMU, power management IC, model Hi6421GFC, Hass own, many Hass program products are visible.
7. The eMMC, for the first time, saw the use of SanDisk's eMMC on the box, model number SDIN5D2-4G, read speed 15MB/S, write speed 9MB/S, and is sufficient for use on the box. The parameters are official parameters and cannot be removed for testing. Students who have questions are referred to official documents. The white label on the first photo is Huawei's own label, with the model number, serial number, and other information.
Eight, WIFI + Bluetooth IC, unfortunately, Huawei on this chip has been polished, can not find the actual model. Visual test is Broadcom's module, supports dual-band, supports Bluetooth 4.0. Through actual measurement, the 171MB file, the copy time of 2.4G is 44 seconds, the actual bandwidth is 31.09Mbps, the same file is copied at 5G, and the actual bandwidth is 24.43Mbps in 56 seconds. According to Huawei's official propaganda, the wireless module supports MIMO, that is, dual antennas, and the theoretical bandwidth should be 300 Mbps. According to the general algorithm, 300 Mbps is generally used for two folds in the actual use environment, and this WIFI part is far from compliance. Basically inferred, is the 65Mbps module, then MIMO also loses meaning. The Bluetooth part supports 4.0 and the actual bandwidth is unknown. I just do not understand a bit, in order to not leak the design, you can completely do the main part of the IC to polish, light polished WIFI + BT module is a matter how ah? Just to make everyone not know the actual bandwidth of WIFI?
Nine, WIFI stability test, because the secret box no wired access, WIFI's stability is very important, the actual test down, 2.4G under the stability of people worrying, 5G down is very smooth. During the test, the routing distance from the blue, yellow, and red lines of the secret box does not exceed 30CM, the red line is 5G, the blue and yellow are 2.4G routes, and the WIFI device is turned off at home, the router is unloaded, and only the secret box is accessed. As you can see, the swing at 2.4G is very large, which means that the signal is unstable. Through the actual NAS play test, the NAS 1080P video is loaded in about 5-8 seconds. When fast-forward, you can directly exit playback. It can be seen that the stability is worrying. It's a little bit better under 5G, but loading is slow, fast-forward flashback still appears from time to time. Currently it is impossible to determine whether it is a driver or a bandwidth issue. We hope that Huawei can make an official statement. After all, the WIFI part is too important for a box that is intended to be hidden behind the TV and has no wired connection.
Tenth, because can't find relevant data, can only presumably judge this IC as HDMI control IC, is responsible for HDMI input and output. Since the K3V2 does not support HDMI input and output, it can only be guessed. Let everyone laughed.
Eleven, various signs on the PCB, there is a button below, wake-up sleep button, do on the PCB, it is estimated to facilitate testing.
Twelve, TF card slot, there is also a button, the actual press no effect, can not determine the function.
Thirteen, WIFI and Bluetooth antenna contacts, there is an antenna interface near each contact, if necessary, change the appearance of the mold, you can directly use the patch antenna or external antenna.
14. Antenna modules, each antenna patch, about 8MM high, about 4MM wide, and the antenna is too small, which may cause the stability and signal problems of WIFI. In fact, the size of WIFI antenna can also be increased. Knowing what to consider, must be done so small.
Fifteen, CPU part of the shield, the internal coverage of the heat sink material. The actual test, playing online high-definition video, at room temperature 17 °C, the whole shell has reached 45 °C, and hope not to affect the stability of long-term use.
Well, to complete the dismantling, the overall process of the product is very good, excellent workmanship, not the general box can be compared, but the lack of software development or not mind, resulting in a substantial discount on the actual experience, not exaggerating that at all The tested box belongs to the downstream level. And the use of the same factory Hass 3716C Hai Mei Di, but not the same language. After all, it is the main control of the mobile phone. The optimization of various video applications is not in place. We hope to solve some key issues during the next firmware update.
Huawei's statement is based on the cell phone process to create a box, then look at what is in the end.
First, the bottom shell, plastic material, four corners with screws and the upper shell fixed, very strong. The three T-shaped projections press the motherboard to ensure that the motherboard is firmly attached.
Second, the upper shell, but also the entire plastic material, the interior is divided into many parts, to strengthen the stability of the upper shell to ensure that the whole machine is not deformed.
Third, the motherboard as a whole, including the positive and negative sides of the motherboard, each main IC has a shield, work is very reliable, reducing the internal electromagnetic interference. PCB overall work is also in place, many general manufacturers do not pay attention to details are in place, such as power inductors on the edge of copper hollowing, can reduce interference, many manufacturers have not seen on the box. After all, it is a big factory. The presumptiveness of light design and manufacture wins over other manufacturers. The black part below is the Bluetooth + WIFI antenna, which is a bit of a problem.
4. The global map of the mother board with the shield removed, and the photo on the opposite side, including a shield cross clip, are shortened. In order to see the WIFI chip, the original state is a cross bracket. Hereby explain.
Fifth, the internal IC part starts with the CPU. The entire surface is not marked with any K3V2, only one Elpida logo. In fact, this IC is stacked. Currently, there is no data to show whether the IC is a POP or an MCP. The POP is a package-level stack in which the CPU and the RAM are manufactured separately. When the IC is packaged, the ICs are packaged together. MCPs are wafer level stacks that are manufactured together at the time of manufacture. The K3V2 is an A9 quad-core with 1.2GHz and 1.5GHz versions. The 1.2GHz version is used on the box. A9 quad-core, GPU part is Vivante's GC4000, 16-core GPU. Do not be terrified by 16 nuclear, in fact, performance and Mail 400 MP4 quad-core GPU performance is similar, that is, the RK3066 GPU, and because of too much bias, the actual compatibility is not yet a good Mail 400 MP4.
The RAM part is Elpida's 1GB DDR2 800 Mobile RAM, model B8164B3PF-1D-F, a special version for mobile devices, which costs more than the PC pellets used on the general box. There is a problem, Elpida has been closed down, was acquired by Micron, then, this IC production time is Elpida still exists. It seems that recently, in order to clean up the K3V2 inventory, Huawei students spent a great deal of effort. Not only did they launch a series of K3V2 mobile phones, but they also continued to launch the main control box. They actively prepared for the launch of the next generation of new masters. Shanda.
Six, PMU, power management IC, model Hi6421GFC, Hass own, many Hass program products are visible.
7. The eMMC, for the first time, saw the use of SanDisk's eMMC on the box, model number SDIN5D2-4G, read speed 15MB/S, write speed 9MB/S, and is sufficient for use on the box. The parameters are official parameters and cannot be removed for testing. Students who have questions are referred to official documents. The white label on the first photo is Huawei's own label, with the model number, serial number, and other information.
Eight, WIFI + Bluetooth IC, unfortunately, Huawei on this chip has been polished, can not find the actual model. Visual test is Broadcom's module, supports dual-band, supports Bluetooth 4.0. Through actual measurement, the 171MB file, the copy time of 2.4G is 44 seconds, the actual bandwidth is 31.09Mbps, the same file is copied at 5G, and the actual bandwidth is 24.43Mbps in 56 seconds. According to Huawei's official propaganda, the wireless module supports MIMO, that is, dual antennas, and the theoretical bandwidth should be 300 Mbps. According to the general algorithm, 300 Mbps is generally used for two folds in the actual use environment, and this WIFI part is far from compliance. Basically inferred, is the 65Mbps module, then MIMO also loses meaning. The Bluetooth part supports 4.0 and the actual bandwidth is unknown. I just do not understand a bit, in order to not leak the design, you can completely do the main part of the IC to polish, light polished WIFI + BT module is a matter how ah? Just to make everyone not know the actual bandwidth of WIFI?
Tenth, because can't find relevant data, can only presumably judge this IC as HDMI control IC, is responsible for HDMI input and output. Since the K3V2 does not support HDMI input and output, it can only be guessed. Let everyone laughed.
Eleven, various signs on the PCB, there is a button below, wake-up sleep button, do on the PCB, it is estimated to facilitate testing.
Twelve, TF card slot, there is also a button, the actual press no effect, can not determine the function.
Thirteen, WIFI and Bluetooth antenna contacts, there is an antenna interface near each contact, if necessary, change the appearance of the mold, you can directly use the patch antenna or external antenna.
14. Antenna modules, each antenna patch, about 8MM high, about 4MM wide, and the antenna is too small, which may cause the stability and signal problems of WIFI. In fact, the size of WIFI antenna can also be increased. Knowing what to consider, must be done so small.
Fifteen, CPU part of the shield, the internal coverage of the heat sink material. The actual test, playing online high-definition video, at room temperature 17 °C, the whole shell has reached 45 °C, and hope not to affect the stability of long-term use.
Well, to complete the dismantling, the overall process of the product is very good, excellent workmanship, not the general box can be compared, but the lack of software development or not mind, resulting in a substantial discount on the actual experience, not exaggerating that at all The tested box belongs to the downstream level. And the use of the same factory Hass 3716C Hai Mei Di, but not the same language. After all, it is the main control of the mobile phone. The optimization of various video applications is not in place. We hope to solve some key issues during the next firmware update.
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